3D IC Stacking Technology
by Wu, Banqiu; Kumar, Ajay; Ramaswami, SeshEdition: 1st
Format: Hardcover
Pub. Date: 2011-07-28
Publisher(s): McGraw-Hill Education
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Summary
The latest advances in three-dimensional integrated circuit stacking technology3D IC Stacking Technologyis a comprehensive resource on three-dimensional stacking technology, including scientific theory, processing methods, applications, and an overview of the industry's technological future. The book is targeted to semiconductor engineers and portable device designers.The quality and functional capabilities of nearly all of today's electronic devices and the production lines that produce them are dependent on key internal semiconductor componentsICs. Lithography and packaging integration are the determining factors in keeping pace with the electronics industry's quest to have more and more transistors on chip product by shrinking ICs and other related products, or by stacking the multiple chips into one chip device. This in-depth volume covers these cutting-edge technologies.3D IC Stacking Technology Focuses on industrial applications Includes detailed fabrication processes Covers a separate fabrication step in each chapter, written by an industry expert Provides a one-stop knowledge resource for 3D IC technology Discusses future applications and device design potentialsComprehensive coverage: Design challenges; Process sequence integration; TSV etch; Chemical vapor; Barrier/ seed deposition; ECD fill; Chemical mechanical polishing; Wafer thinning; Temporary and permanent bonding; Cost of ownership
Table of Contents
Chapter 1. Introduction to High-Density Through Silicon Stacking Technology
Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products
Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack
Chapter 4. Process Integration for TSV Manufacturing
Chapter 5. High-Aspect-Ratio Silicon Etch for TSV
Chapter 6. Dielectric Deposition for Through Silicon Vias
Chapter 7. Barrier and Seed Deposition
Chapter 8. Copper Electrodeposition for TSV
Chapter 9. Chemical Mechanical Polishing for TSV
Chapter 10. Temporary and Permanent Bonding
Chapter 11. Assembly and Test Aspects of TSV Technology
Index
Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products
Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack
Chapter 4. Process Integration for TSV Manufacturing
Chapter 5. High-Aspect-Ratio Silicon Etch for TSV
Chapter 6. Dielectric Deposition for Through Silicon Vias
Chapter 7. Barrier and Seed Deposition
Chapter 8. Copper Electrodeposition for TSV
Chapter 9. Chemical Mechanical Polishing for TSV
Chapter 10. Temporary and Permanent Bonding
Chapter 11. Assembly and Test Aspects of TSV Technology
Index
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